Operation of a static, current mode logic (CML) frequency divider to clock frequencies exceeding 150GHz is reported. The divide-by-8 circuit described here has been realized in a highly scaled 0.4/spl mu/m InP/InGaAs/InP DHBT technology, dissipates only 45mW per latch, and achieves this using purely resistive loads. Thermal limitations in device performance are observed to play a key role, demonstrating the need for aggressive heat management in high speed technologies. On a full thickness wafer in a 27/spl deg/C ambient, the maximum operating frequency of the divider was 143.6GHz; this range extended to 151.2GHz when an air flow at -30/spl deg/C was established across the wafer.
