التفاصيل البيبلوغرافية
العنوان:
Die to wafer direct bonding: from fundamental mechanisms to optoelectronic and 3D applications
المؤلفون:
V. Larrey , A. Jouve , Frank Fournel , Karim Hassan , Bertrand Szelag , Loic Sanchez , G. Mauguen , Severine Cheramy , L. Bally , M. Laugier , François Rieutord , Emmanuel Rolland , C. Castan , B. Montmayeul , L. Adelimini , Christophe Morales
المصدر:
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) .
بيانات النشر:
IEEE, 2019.
سنة النشر:
2019
مصطلحات موضوعية:
Materials science , Silicon , business.industry , Wafer bonding , chemistry.chemical_element , Direct bonding , Die (integrated circuit) , chemistry.chemical_compound , chemistry , Indium phosphide , Optoelectronics , Wafer , Photonics , business
الوصف:
Direct wafer bonding of wafers is now well establish. However in many interesting applications, direct bonding of die to wafer can lead to innovative devices. After explaining some specific fundamental mechanisms, III/V die to wafer bonding and copper hybrid bonding will be presented for photonic and 3D applications.
URL الوصول:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fbcd67e3c45e989eabf98e6049476e3 https://doi.org/10.23919/ltb-3d.2019.8735248
رقم الأكسشن:
edsair.doi...........0fbcd67e3c45e989eabf98e6049476e3
قاعدة البيانات:
OpenAIRE
