Cu Nanospring Films for Advanced Nanothermal Interfaces
| العنوان: | Cu Nanospring Films for Advanced Nanothermal Interfaces |
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| المؤلفون: | Debashish Das, Ioannis Chasiotis, David Shaddock, Ryan N. Mott, Dimitrios A. Antartis |
| المصدر: | Advanced Engineering Materials. 20:1700910 |
| بيانات النشر: | Wiley, 2018. |
| سنة النشر: | 2018 |
| مصطلحات موضوعية: | 010302 applied physics, Glancing angle deposition, Toughness, Thermal conductivity, Materials science, 0103 physical sciences, General Materials Science, 02 engineering and technology, Composite material, 021001 nanoscience & nanotechnology, 0210 nano-technology, Condensed Matter Physics, 01 natural sciences |
| تدمد: | 1527-2648 1438-1656 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::12f825dcb514615fe1b0db6681e6531f https://doi.org/10.1002/adem.201700910 |
| حقوق: | OPEN |
| رقم الأكسشن: | edsair.doi...........12f825dcb514615fe1b0db6681e6531f |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 15272648 14381656 |
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