Process window improvement for fin cut layer in self-aligned double-patterning process based on backscattered electron imaging

التفاصيل البيبلوغرافية
العنوان: Process window improvement for fin cut layer in self-aligned double-patterning process based on backscattered electron imaging
المؤلفون: Yu Zhang, David Wei Zhang, Yuyang Bian, Biqiu Liu, Cong Zhang, Jun Huang, Jiawang Song, Yang Gao, Qiang Zhou, Wei Chen, Siqun Xiao, Shmuel Ben Nissim, Kevin Houchens, Omri Baum, Amit Zakay, Tal Ayzik, Yaniv Abramovitz
المصدر: Journal of Micro/Nanopatterning, Materials, and Metrology. 21
بيانات النشر: SPIE-Intl Soc Optical Eng, 2022.
سنة النشر: 2022
تدمد: 2708-8340
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::132931604fa8372bd4ac7cc9d438b449
https://doi.org/10.1117/1.jmm.21.4.041605
رقم الأكسشن: edsair.doi...........132931604fa8372bd4ac7cc9d438b449
قاعدة البيانات: OpenAIRE