التفاصيل البيبلوغرافية
العنوان:
Electroplating through holes with different geometry -- A novel and high productivity process for through hole fill plating
المؤلفون:
Jayaraju Nagarajan , Mark Lefebvre , Maria Anna Rzeznik , Leon R. Barstad , Elie H. Najjar , Marc Lin
المصدر:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) .
بيانات النشر:
IEEE, 2012.
سنة النشر:
2012
مصطلحات موضوعية:
Range (particle radiation) , Materials science , Volume (thermodynamics) , business.industry , Plating , Metallurgy , Optoelectronics , Core (manufacturing) , Substrate (printing) , Electroplating , business , Layer (electronics) , Current density
الوصف:
A novel DC through hole filling process was formulated for high volume HDI and substrate core layer metallization production. The process yields high quality results over a wide current density range.
URL الوصول:
https://explore.openaire.eu/search/publication?articleId=doi_________::164fa99a541df77b7c8f0f6a01897dce https://doi.org/10.1109/impact.2012.6420311
رقم الأكسشن:
edsair.doi...........164fa99a541df77b7c8f0f6a01897dce
قاعدة البيانات:
OpenAIRE
