Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study

التفاصيل البيبلوغرافية
العنوان: Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study
المؤلفون: Helene Conseil-Gudla, Max Spooner, Murat Kulahci, Rajan Ambat
المصدر: Microelectronics Reliability. 136:114655
بيانات النشر: Elsevier BV, 2022.
سنة النشر: 2022
مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials
تدمد: 0026-2714
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1b0b0b88190d0fa9a4d25385158c78a2
https://doi.org/10.1016/j.microrel.2022.114655
حقوق: CLOSED
رقم الأكسشن: edsair.doi...........1b0b0b88190d0fa9a4d25385158c78a2
قاعدة البيانات: OpenAIRE