Design and verification of modular and reusable aging test system for high power SIP
العنوان: | Design and verification of modular and reusable aging test system for high power SIP |
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المؤلفون: | Haoyue Ji, Yuhe Duan, Xiaodong Sun, Wenchao Tian, Hao Cui |
المصدر: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). |
بيانات النشر: | IEEE, 2022. |
سنة النشر: | 2022 |
URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::27753d76d68ea12e6a573801d35fd08a https://doi.org/10.1109/icept56209.2022.9873206 |
حقوق: | CLOSED |
رقم الأكسشن: | edsair.doi...........27753d76d68ea12e6a573801d35fd08a |
قاعدة البيانات: | OpenAIRE |
الوصف غير متاح. |