Asymmetric Growth of Cu6sn5 Intermetallic Compound in Cu/Sn/Cu Interconnection System Under the Vertical Ultrasonic Vibration
| العنوان: | Asymmetric Growth of Cu6sn5 Intermetallic Compound in Cu/Sn/Cu Interconnection System Under the Vertical Ultrasonic Vibration |
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| المؤلفون: | Hongwei Niu, Hong Bian, Xiao Liu, X.G. Song, H.Y. Zhao |
| بيانات النشر: | Elsevier BV, 2023. |
| سنة النشر: | 2023 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::30cbdbf25de9796c6bc4027db68366cd https://doi.org/10.2139/ssrn.4465360 |
| رقم الأكسشن: | edsair.doi...........30cbdbf25de9796c6bc4027db68366cd |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |