Pattern analysis and classification accelerates OPC tuning, monitoring, and optimization and mask inspection

التفاصيل البيبلوغرافية
العنوان: Pattern analysis and classification accelerates OPC tuning, monitoring, and optimization and mask inspection
المؤلفون: Paul Lupa, Ruoping Wang, Jason Sweis, Ya-Chieh Lai, Philippe Hurat
المصدر: Design-Process-Technology Co-optimization for Manufacturability XII.
بيانات النشر: SPIE, 2018.
سنة النشر: 2018
مصطلحات موضوعية: Matching (statistics), Computer science, Hardware_INTEGRATEDCIRCUITS, Pattern analysis, Mask inspection, Data mining, Pattern matching, Cadence, computer.software_genre, Fuzzy logic, computer
الوصف: Advances in pattern-based layout tools enable automatic and rapid capture, tailoring, creation, classification, and comparison/matching (accurate or fuzzy) of large quantities of patterns. Applications of such tools have significantly improved traditional script- or manual- based approaches, and have produced impressive results in production OPC and mask work. In this work, we introduce into NXP mask preparation a flow with pattern-matching-assisted mask data inspection solution, employing Cadence Pattern Analysis (CPA) tool. We also engage in CPA-facilitated creation of pattern libraries to achieve more comprehensive results in more automatic ways than what could be realized with traditional approaches, and utilize these patterns to accelerate OPC tuning, monitoring, and optimization.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3b1692b8ad84fed72dc06c5c0dd2c57e
https://doi.org/10.1117/12.2297097
رقم الأكسشن: edsair.doi...........3b1692b8ad84fed72dc06c5c0dd2c57e
قاعدة البيانات: OpenAIRE