Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
| العنوان: | Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density |
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| المؤلفون: | Tae-Gyu Woo, Il-Song Park |
| المصدر: | Korean Journal of Metals and Materials. 58:41-48 |
| بيانات النشر: | The Korean Institute of Metals and Materials, 2020. |
| سنة النشر: | 2020 |
| مصطلحات موضوعية: | Mechanical property, Materials science, Metals and Alloys, chemistry.chemical_element, Copper, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry, Electrical resistivity and conductivity, Modeling and Simulation, Composite material, Electroplating, Layer (electronics), High current density |
| تدمد: | 2288-8241 1738-8228 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::428ba6b15a4095e820d3fb0accc16755 https://doi.org/10.3365/kjmm.2020.58.1.41 |
| حقوق: | OPEN |
| رقم الأكسشن: | edsair.doi...........428ba6b15a4095e820d3fb0accc16755 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 22888241 17388228 |
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