Investigation of moisture uptake into printed circuit board laminate and solder mask materials
| العنوان: | Investigation of moisture uptake into printed circuit board laminate and solder mask materials |
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| المؤلفون: | Morten Stendahl Jellesen, Visweswara Chakravarthy Gudla, Rajan Ambat, Helene Conseil-Gudla, Shruti Borgaonkar |
| المصدر: | Journal of Materials Science: Materials in Electronics. 28:6138-6151 |
| بيانات النشر: | Springer Science and Business Media LLC, 2017. |
| سنة النشر: | 2017 |
| مصطلحات موضوعية: | 010302 applied physics, Materials science, Moisture, Scanning electron microscope, 02 engineering and technology, Epoxy, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Microstructure, 01 natural sciences, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Printed circuit board, Reflow soldering, Soldering, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material, 0210 nano-technology, Solder mask |
| الوصف: | Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with the moisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and on increase of water uptake of the materials has been analysed. |
| تدمد: | 1573-482X 0957-4522 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::4ff1ff00a87ed189df2454c35b35cc86 https://doi.org/10.1007/s10854-016-6292-5 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........4ff1ff00a87ed189df2454c35b35cc86 |
| قاعدة البيانات: | OpenAIRE |
Find this article in full text from Springer Verlag. | تدمد: | 1573482X 09574522 |
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