Evaluation of subsurface defects in fiber glass composite plate using lock-in technique
| العنوان: | Evaluation of subsurface defects in fiber glass composite plate using lock-in technique |
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| المؤلفون: | Kyung-Young Jhang, Ghiseok Kim, Geon Hee Kim, Soonsung Hong |
| المصدر: | International Journal of Precision Engineering and Manufacturing. 13:465-470 |
| بيانات النشر: | Springer Science and Business Media LLC, 2012. |
| سنة النشر: | 2012 |
| مصطلحات موضوعية: | Materials science, business.industry, Mechanical Engineering, Fiber glass, Industrial and Manufacturing Engineering, Signal-to-noise ratio, Optics, Shearography, Composite plate, Thermography, Thermal, Reflection (physics), Sensitivity (control systems), Electrical and Electronic Engineering, business |
| الوصف: | In this paper, the lock-in algorithm from lock-in thermography was applied in digital shearography to evaluate the subsurface defects in fiber glass composite plate. Lock-in thermography is one of active infrared thermography which is based on propagation and reflection of thermal wave while lock-in shearography is one of optical interferometric imaging technique which is based on displacement gradient changes in a fringe pattern by mechanical or thermal loading. By applying the lock-in method to digital shearography, its sensitivity can be enhanced by phase sensitive narrow-band filtering as well as the improved signal to noise ratio, selective defects detection. Artificial defects in fiber glass composite plate were evaluated by digital shearography and lock-in shearography NDE techniques to compare their detection capacity. The experimental results confirmed that lock-in method’s efficiency on subsurface defects detection in composite plate specimen. |
| تدمد: | 2005-4602 2234-7593 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::53458dd287df8427e255af835736ef4d https://doi.org/10.1007/s12541-012-0061-z |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........53458dd287df8427e255af835736ef4d |
| قاعدة البيانات: | OpenAIRE |
Find this article in full text from Springer Verlag. | تدمد: | 20054602 22347593 |
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