Growth and characterization of DH‐HEMT structures with various AlGaN barriers and AlN interlayers on 200 mm Si(111) substrates

التفاصيل البيبلوغرافية
العنوان: Growth and characterization of DH‐HEMT structures with various AlGaN barriers and AlN interlayers on 200 mm Si(111) substrates
المؤلفون: Andrea Firrincieli, P. K. Kandaswamy, Ming Zhao, Stefaan Decoutere, Yoga Saripalli, E. Vancoille, Hu Liang
المصدر: physica status solidi c. 11:446-449
بيانات النشر: Wiley, 2014.
سنة النشر: 2014
مصطلحات موضوعية: Materials science, business.industry, Transistor, Heterojunction, Chemical vapor deposition, High-electron-mobility transistor, Condensed Matter Physics, Characterization (materials science), law.invention, law, Optoelectronics, Wafer, business, Fermi gas, Sheet resistance
الوصف: AlGaN/GaN/AlGaN double heterojunction high-electron-mobility transistors were grown on 200 mm Si (111) using metalorganic chemical vapor deposition. The Al composition of AlGaN barrier varied from 20 at% to 30 at% and thickness from 10 nm to 20 nm. In some structures, a 1 nm AlN interlayer was inserted between AlGaN barrier and GaN channel. The as-grown wafers were proven to be of high material quality and the layer thickness were well controlled to the target values. A buffer break down voltage of over 700 V were obtained for all grown wafers. Compared to their counterparts without AlN interlayer, structures with AlN interlayer showed a much lower and more uniform two-dimensional electron gas sheet resistance. With the presence of AlN interlayer, the sheet resistance was much less sensitive towards variations in AlGaN barrier composition and thickness. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)
تدمد: 1610-1642
1862-6351
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::59ed2a6f94b6114258cdd3dfce6c94e7
https://doi.org/10.1002/pssc.201300478
حقوق: CLOSED
رقم الأكسشن: edsair.doi...........59ed2a6f94b6114258cdd3dfce6c94e7
قاعدة البيانات: OpenAIRE