The IC Ultra-Thin Back Surface - A Field of Real Nanoscale Fault Isolation Opportunities Requiring a Skillful Sample Preparation
| العنوان: | The IC Ultra-Thin Back Surface - A Field of Real Nanoscale Fault Isolation Opportunities Requiring a Skillful Sample Preparation |
|---|---|
| المؤلفون: | C. Boit, J. Jatzkowski, F. Altmann, M. DiBattista, S. Silverman, G. Zwicker, N. Herfurth, E. Amini, J.-P. Seifert |
| المصدر: | 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). |
| بيانات النشر: | IEEE, 2022. |
| سنة النشر: | 2022 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::6d92dd18a47da8e423f27c0f6a4059e4 https://doi.org/10.1109/ipfa55383.2022.9915783 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........6d92dd18a47da8e423f27c0f6a4059e4 |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |