A new on-state drain-bias TDDB lifetime model and HCI effect on drain-bias TDDB of ultra thin oxide

التفاصيل البيبلوغرافية
العنوان: A new on-state drain-bias TDDB lifetime model and HCI effect on drain-bias TDDB of ultra thin oxide
المؤلفون: P.J. Liao, Chia Lin Chen, Y.S. Tsai, J.W. Young, C.J. Wang, K. Wu
المصدر: 2008 IEEE International Reliability Physics Symposium.
بيانات النشر: IEEE, 2008.
سنة النشر: 2008
مصطلحات موضوعية: Materials science, business.industry, Electric breakdown, Electrical engineering, Oxide, Time-dependent gate oxide breakdown, chemistry.chemical_compound, Reliability (semiconductor), chemistry, Logic gate, Optoelectronics, business, Thin oxide, Voltage drop, Hot carrier effect
الوصف: For the first time, a new drain-bias TBD lifetime model is proposed to precisely predict at various Vd, Vg and channel length for ultra thin oxide. The TBD lifetime with drain-bias can be decoupled to small voltage drop at drain-side increased TBD lifetime and hot carrier effect (HCI) degraded the TBD lifetime. The mechanism of oxide breakdown with drain-bias is also well understood as oxide traps distributed from the source side to the center of channel induce the oxide breakdown.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::70f30c8f22632a43a8951c47d4395383
https://doi.org/10.1109/relphy.2008.4558888
رقم الأكسشن: edsair.doi...........70f30c8f22632a43a8951c47d4395383
قاعدة البيانات: OpenAIRE