We have demonstrated out-of-focus ultrafast pulsed laser processing of copper with a variable working distance, without the need for mechanical movement. This was achieved by employing a diffractive optical element. The method has been demonstrated in a practical application to reduce the secondary electron yield (SEY) of copper to below 1.3. We show that using an extended focus element not only increases the consistency of processing across a range of working distances, but also changes the topography of the produced structures, reducing the SEY. This presented approach shows promise in facilitating the Large Hadron Collider’s (LHC’s) upcoming high luminosity upgrade by preventing electron clouds.
