Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence

التفاصيل البيبلوغرافية
العنوان: Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence
المؤلفون: Chanyeol Choi, Hyunseok Kim, Ji-Hoon Kang, Min-Kyu Song, Hanwool Yeon, Celesta S. Chang, Jun Min Suh, Jiho Shin, Kuangye Lu, Bo-In Park, Yeongin Kim, Han Eol Lee, Doyoon Lee, Jaeyong Lee, Ikbeom Jang, Subeen Pang, Kanghyun Ryu, Sang-Hoon Bae, Yifan Nie, Hyun S. Kum, Min-Chul Park, Suyoun Lee, Hyung-Jun Kim, Huaqiang Wu, Peng Lin, Jeehwan Kim
المصدر: Nature Electronics. 5:386-393
بيانات النشر: Springer Science and Business Media LLC, 2022.
سنة النشر: 2022
مصطلحات موضوعية: Electrical and Electronic Engineering, Instrumentation, Electronic, Optical and Magnetic Materials
تدمد: 2520-1131
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8e1b09218c98658752df5f22c1ef0ab7
https://doi.org/10.1038/s41928-022-00778-y
حقوق: CLOSED
رقم الأكسشن: edsair.doi...........8e1b09218c98658752df5f22c1ef0ab7
قاعدة البيانات: OpenAIRE