Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
| العنوان: | Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer |
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| المؤلفون: | jun mi jeon, Sang‑Jun Kwon, Seok Bon Koo, Chang‑Myeon Lee, Jin Young Hur, Hong-Kee Lee |
| المصدر: | Metals and Materials International. 25:117-126 |
| بيانات النشر: | Springer Science and Business Media LLC, 2018. |
| سنة النشر: | 2018 |
| مصطلحات موضوعية: | Copper oxide, Materials science, 020502 materials, Metals and Alloys, chemistry.chemical_element, 02 engineering and technology, Adhesion, Condensed Matter Physics, Copper, chemistry.chemical_compound, 0205 materials engineering, chemistry, Mechanics of Materials, Impurity, Plating, Materials Chemistry, Grain boundary, Composite material, Layer (electronics), Polyimide |
| الوصف: | This paper experimentally confirmed that the adhesion strength of the copper layer formed on the surface of the polyimide film by wet plating greatly changes with the aging time. The adhesion strength of the copper layer showed a rapid increase from 4 to 10 h after aging had begun and then converged to a value without a significant change. The adhesion enhancement between polyimide film and copper layer by aging is due to the interlocking effect caused by the volume expansion of copper oxide (CuO) formed in the polyimide, the increased mobility of copper particles enlarged by the decrease of impurities in the copper layer grain boundaries, and the consequent change of the crystal structure of the copper layer leading to the internal stress reduction. Such adhesion improvement can be confirmed by the progress of the cohesive failure indicating the breakdown of the polyimide film. |
| تدمد: | 2005-4149 1598-9623 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::8ed64c2dc6e288c124b48e1e1405bea7 https://doi.org/10.1007/s12540-018-0167-7 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........8ed64c2dc6e288c124b48e1e1405bea7 |
| قاعدة البيانات: | OpenAIRE |
Find this article in full text from Springer Verlag. | تدمد: | 20054149 15989623 |
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