التفاصيل البيبلوغرافية
| العنوان: |
Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper |
| المؤلفون: |
Kyeong-Won Seol, Tae-Gyu Woo, Il-Song Park |
| المصدر: |
Korean Journal of Metals and Materials. 56:459-464 |
| بيانات النشر: |
The Korean Institute of Metals and Materials, 2018. |
| سنة النشر: |
2018 |
| مصطلحات موضوعية: |
Materials science, 020209 energy, Metallurgy, Metals and Alloys, chemistry.chemical_element, 02 engineering and technology, 021001 nanoscience & nanotechnology, Copper, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Taguchi methods, chemistry, Modeling and Simulation, Plating, 0202 electrical engineering, electronic engineering, information engineering, 0210 nano-technology, Electroplating, Current density |
| تدمد: |
2288-8241
1738-8228 |
| URL الوصول: |
https://explore.openaire.eu/search/publication?articleId=doi_________::99fc318b98b75c22c4686073383710b2
https://doi.org/10.3365/kjmm.2018.56.6.459 |
| حقوق: |
OPEN |
| رقم الأكسشن: |
edsair.doi...........99fc318b98b75c22c4686073383710b2 |
| قاعدة البيانات: |
OpenAIRE |
