Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly <111>-oriented Nano-twinned Cu with Low Contact Resistivity and High Bonding Strength
| العنوان: | Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly <111>-oriented Nano-twinned Cu with Low Contact Resistivity and High Bonding Strength |
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| المؤلفون: | Jia-Juen Ong, Dinh-Phuc Tran, Yu-Min Hsun, Wei-Lan Chiu, Ou-Hsiang Lee, Hsiang-Hung Chang, Chih Chen |
| المصدر: | 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| بيانات النشر: | IEEE, 2022. |
| سنة النشر: | 2022 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::a66139431605596f89d2c074ca6307ca https://doi.org/10.1109/impact56280.2022.9966728 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........a66139431605596f89d2c074ca6307ca |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |