3D Stacked Nanowires CMOS Integration with a Damascene Finfet Process
| العنوان: | 3D Stacked Nanowires CMOS Integration with a Damascene Finfet Process |
|---|---|
| المؤلفون: | Thomas Ernst, Simon Deleonibus, Sébastien Barnola, Erwan Dornel, Cecilia Dupre, Jean-Charles Barbe, S. Becu, Francois Andrieu, C. Vizioz, O. Faynot, Vincent Delaye, J-M. Hartmann, Gerard Ghibaudo, Thierry Poiroux |
| المصدر: | Extended Abstracts of the 2007 International Conference on Solid State Devices and Materials. |
| بيانات النشر: | The Japan Society of Applied Physics, 2007. |
| سنة النشر: | 2007 |
| مصطلحات موضوعية: | Materials science, CMOS, Copper interconnect, Nanowire, Process (computing), Nanotechnology |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::ac6c60e4a8c4f4579c2ee49a42673414 https://doi.org/10.7567/ssdm.2007.i-1-1 |
| رقم الأكسشن: | edsair.doi...........ac6c60e4a8c4f4579c2ee49a42673414 |
| قاعدة البيانات: | OpenAIRE |
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