The latent heat of solidification of any alloy depends on its chemistry that consequently affects the macro and microstructures for the given solidification conditions. In order to analyze the effects of chemistry on the release of latent heat during solidification of the industrial 3XX series of aluminum alloys, four different levels of silicon (5, 7, 9 and 11wt% Si) and three different levels of copper (1, 2 and 4 wt% of Cu) were taken into consideration. The solidification process was studied at cooling rates of 6 and 10°C/minute. The solidification path of these alloys was determined and the corresponding latent heat released during the solidification process was measured using a Differential Scanning Calorimeter (DSC). The tested hypoeutectic alloy chemical composition was expressed by the novel concept of silicon equivalency. The findings indicate that increases in the cooling rates shift the characteristic temperatures toward lower values without having a significant effect on the amount of released latent heat.
