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Challenges for System Supplier Failure Analysis on Subsystem Components

التفاصيل البيبلوغرافية
العنوان: Challenges for System Supplier Failure Analysis on Subsystem Components
المؤلفون: Xuming Deng, Weidong Huang, Changhong Yu, Xiongjian Wu, Yang Xu, Xiaole Zhao, Qing Gu
المصدر: EDFA Technical Articles. 24:4-10
بيانات النشر: ASM International, 2022.
سنة النشر: 2022
مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality
الوصف: The failure of a white LED backlight module in a portable computer illustrates the challenges that component and system suppliers must overcome in order to determine root-cause failure mechanisms and take corrective actions that address the problem.
تدمد: 1537-0755
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::af9dff49893c2920e5127ea22dbabf70
https://doi.org/10.31399/asm.edfa.2022-2.p004
رقم الأكسشن: edsair.doi...........af9dff49893c2920e5127ea22dbabf70
قاعدة البيانات: OpenAIRE
الوصف
تدمد:15370755