Failure analysis on false call probe pins of microprocessor test equipment

التفاصيل البيبلوغرافية
العنوان: Failure analysis on false call probe pins of microprocessor test equipment
المؤلفون: V. Retnasamy, L. W. Tang, N. R. Ong, J. B. Alcain, Ili Salwani Mohamad
المصدر: AIP Conference Proceedings.
بيانات النشر: Author(s), 2017.
سنة النشر: 2017
مصطلحات موضوعية: Engineering, business.industry, Test equipment, Motherboard, Health condition, Power (physics), law.invention, Microprocessor, Software, law, Embedded system, Experimental work, Ohm, business, Computer hardware
الوصف: A study has been conducted to investigate failure analysis on probe pins of test modules for microprocessor. The ‘health condition’ of the probe pin is determined by the resistance value. A test module of 5V power supplied from Arduino UNO with “Four-wire Ohm measurement” method is implemented in this study to measure the resistance of the probe pins of a microprocessor. The probe pins from a scrapped computer motherboard is used as the test sample in this study. The functionality of the test module was validated with the pre-measurement experiment via VEE Pro software. Lastly, the experimental work have demonstrated that the implemented test module have the capability to identify the probe pin’s ‘health condition’ based on the measured resistance value.
تدمد: 0094-243X
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b53391661bbfa55d0572a3b32cfa6290
https://doi.org/10.1063/1.5002486
رقم الأكسشن: edsair.doi...........b53391661bbfa55d0572a3b32cfa6290
قاعدة البيانات: OpenAIRE