التفاصيل البيبلوغرافية
العنوان:
Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits
المؤلفون:
Wu Kai-Chiang , Kun-You Lin , C.H. Tsai , Che-Wei Hsu , Lu Chun-Lin , H. Wang , C. T. Wang , Doug C. H. Yu , K. Y. Kao , C. S. Liu , Tang Tzu-Chun , Tzong-Lin Wu , Pu Han-Ping
المصدر:
2019 IEEE International Electron Devices Meeting (IEDM) .
بيانات النشر:
IEEE, 2019.
سنة النشر:
2019
مصطلحات موضوعية:
Beamforming , Materials science , business.industry , Bandwidth (signal processing) , 020206 networking & telecommunications , 02 engineering and technology , law.invention , Front and back ends , Antenna array , CMOS , law , Extremely high frequency , 0202 electrical engineering, electronic engineering, information engineering , Optoelectronics , Dipole antenna , business , Electronic circuit
الوصف:
A high performance 3D dipole antenna with metal thickness >100 μm for wide bandwidth and lateral radiation is realized on InFO package. 25 % wide fractional bandwidth, from 60 to 77 GHz, has been obtained. The beamforming capability of the antenna array system with 6 dBi gain is measured in a 40 nm CMOS RFIC co-designed system.
URL الوصول:
https://explore.openaire.eu/search/publication?articleId=doi_________::b78780a82f2cd3aa0d37cb2e6073fe2e https://doi.org/10.1109/iedm19573.2019.8993591
حقوق:
CLOSED
رقم الأكسشن:
edsair.doi...........b78780a82f2cd3aa0d37cb2e6073fe2e
قاعدة البيانات:
OpenAIRE
