Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits
العنوان: | Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits |
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المؤلفون: | Wu Kai-Chiang, Kun-You Lin, C.H. Tsai, Che-Wei Hsu, Lu Chun-Lin, H. Wang, C. T. Wang, Doug C. H. Yu, K. Y. Kao, C. S. Liu, Tang Tzu-Chun, Tzong-Lin Wu, Pu Han-Ping |
المصدر: | 2019 IEEE International Electron Devices Meeting (IEDM). |
بيانات النشر: | IEEE, 2019. |
سنة النشر: | 2019 |
مصطلحات موضوعية: | Beamforming, Materials science, business.industry, Bandwidth (signal processing), 020206 networking & telecommunications, 02 engineering and technology, law.invention, Front and back ends, Antenna array, CMOS, law, Extremely high frequency, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Dipole antenna, business, Electronic circuit |
الوصف: | A high performance 3D dipole antenna with metal thickness >100 μm for wide bandwidth and lateral radiation is realized on InFO package. 25 % wide fractional bandwidth, from 60 to 77 GHz, has been obtained. The beamforming capability of the antenna array system with 6 dBi gain is measured in a 40 nm CMOS RFIC co-designed system. |
URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::b78780a82f2cd3aa0d37cb2e6073fe2e https://doi.org/10.1109/iedm19573.2019.8993591 |
حقوق: | CLOSED |
رقم الأكسشن: | edsair.doi...........b78780a82f2cd3aa0d37cb2e6073fe2e |
قاعدة البيانات: | OpenAIRE |
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