High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques
| العنوان: | High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques |
|---|---|
| المؤلفون: | Wensong Wang, Zilian Qu, Yuanjin Zheng, Qiwen Bao, Zhengchun Yang |
| المصدر: | IEEE Transactions on Industrial Electronics. 69:9556-9565 |
| بيانات النشر: | Institute of Electrical and Electronics Engineers (IEEE), 2022. |
| سنة النشر: | 2022 |
| مصطلحات موضوعية: | Materials science, Control and Systems Engineering, business.industry, law, Electromagnetic coil, Eddy current, Optoelectronics, Wafer, Electrical and Electronic Engineering, business, Sensitivity (electronics), law.invention |
| تدمد: | 1557-9948 0278-0046 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::c3cc478cf2f8f2c2db76faecf4f5bb5e https://doi.org/10.1109/tie.2021.3111570 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........c3cc478cf2f8f2c2db76faecf4f5bb5e |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 15579948 02780046 |
|---|