A compact, double sided cooled, 6-in-1 IGBT module has been designed with an innovative packaging structure combing the different advanced packaging technologies. This paper reports the packaging technologies used to assemble the module, the improved thermal and electrical performance of the assembled module in comparison with a commercially available high performance IGBT module, and the proven power cycling reliability of the present module assembled using the optimized structure, material and processing factors. The present IGBT module can hence provide more efficient solutions for applications in EV /HEV motor controls.
