Formation of Defects in Solid-Liquid Reaction-Diffusion Bonding of Copper Using a Tin Film Interlayer
| العنوان: | Formation of Defects in Solid-Liquid Reaction-Diffusion Bonding of Copper Using a Tin Film Interlayer |
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| المؤلفون: | Hiroaki Hokazono, Kozo Fujimoto, Shinji Fukumoto, Toshinari Kizawa, Michiya Matsushima |
| المصدر: | Journal of Smart Processing. 6:188-194 |
| بيانات النشر: | Sumart Processing Society for Minerals, Environment and Energy, 2017. |
| سنة النشر: | 2017 |
| مصطلحات موضوعية: | Materials science, chemistry, Chemical engineering, Reaction–diffusion system, chemistry.chemical_element, Tin, Copper, Solid liquid |
| تدمد: | 2187-1337 2186-702X |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::caf2a21663f66ec82eb8315d713b7fd7 https://doi.org/10.7791/jspmee.6.188 |
| حقوق: | OPEN |
| رقم الأكسشن: | edsair.doi...........caf2a21663f66ec82eb8315d713b7fd7 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 21871337 2186702X |
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