Electromigration Induced Break-up Phenomena in Liquid Metal Printed Thin Films
| العنوان: | Electromigration Induced Break-up Phenomena in Liquid Metal Printed Thin Films |
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| المؤلفون: | Jing Liu, Cangran Guo, Yi-Xin Zhou, Rongchao Ma |
| المصدر: | Journal of Electronic Materials. 43:4255-4261 |
| بيانات النشر: | Springer Science and Business Media LLC, 2014. |
| سنة النشر: | 2014 |
| مصطلحات موضوعية: | Liquid metal, Materials science, business.industry, Nanotechnology, Condensed Matter Physics, Electromigration, Electronic, Optical and Magnetic Materials, Materials Chemistry, Microelectronics, Electronics, Electrical and Electronic Engineering, Thin film, business, Electrical conductor, Microscale chemistry, Electronic circuit |
| الوصف: | Room temperature liquid metal (RTLM)-related electronics has recently been found increasingly important in a wide variety of emerging areas. In particular, printable liquid metal ink opens the way for direct writing of electronics spanning form microscale to even nanoscale. However, such fluid-like circuits also raised important fundamental as well as practical issues for solving. A big issue facing its future large-scale application is that the failure features of the conductive wires under electrical current densities are not clear. Here, we discovered for the first time that a liquid metal thin film would be broken by the so-called electromigration effect as the applied current increases to a critical magnitude. A theoretical model was established to preliminarily interpret the phenomena and the related effects. The break-up effect in the liquid metal-based circuits could be one of the major hurdles that must be tackled with caution in the research and application of future liquid metal technologies, especially for the printed microelectronics thus enabled. |
| تدمد: | 1543-186X 0361-5235 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::cbfb2533d6c12acde9bb11f2abcc0059 https://doi.org/10.1007/s11664-014-3366-0 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........cbfb2533d6c12acde9bb11f2abcc0059 |
| قاعدة البيانات: | OpenAIRE |
Find this article in full text from Springer Verlag. | تدمد: | 1543186X 03615235 |
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