Effect of Physical Property and Surface Morphology of Copper Foil at Electrodeposition Parameter
| العنوان: | Effect of Physical Property and Surface Morphology of Copper Foil at Electrodeposition Parameter |
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| المؤلفون: | Tae Gyu Woo, Il Song Park, Man Hyung Lee, Kyeong Won Seol |
| المصدر: | Korean Journal of Metals and Materials. 52:467-473 |
| بيانات النشر: | The Korean Institute of Metals and Materials, 2014. |
| سنة النشر: | 2014 |
| مصطلحات موضوعية: | Surface (mathematics), Morphology (linguistics), Materials science, Metals and Alloys, chemistry.chemical_element, Nanotechnology, Copper, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Physical property, chemistry, Modeling and Simulation, Copper foil, Deposition (phase transition), Composite material, FOIL method |
| تدمد: | 2288-8241 1738-8228 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::dcc0dfd24d5d8614ef0bfccc012ff0c0 https://doi.org/10.3365/kjmm.2014.52.6.467 |
| حقوق: | OPEN |
| رقم الأكسشن: | edsair.doi...........dcc0dfd24d5d8614ef0bfccc012ff0c0 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 22888241 17388228 |
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