With the increasing of packaging and power density and the reduction of the packaging size, the optimization placement of components becomes a key role on thermal management of the multiple components modules. In this paper, a novel algorithm based on thermal force-directed placement algorithm (TFPA) is proposed, with improved thermal force model and the consideration of the components' size effect. The simulation results show that, while maintaining optimal components placement, the revised algorithm can overcome the components overlapping and out-of-boundary problems occurred in the original TFPA effectively.
