Evaluation of Deterioration Life of Interface of Copper and Epoxy Resin under High Temperature and High Humidity Conditions
| العنوان: | Evaluation of Deterioration Life of Interface of Copper and Epoxy Resin under High Temperature and High Humidity Conditions |
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| المؤلفون: | Hiroaki Hokazono, Yu Tonozuka, Toku Ezure, Ikuo Shohji, Kuniaki Takahashi, Tatsuya Kobayashi |
| المصدر: | Journal of Smart Processing. 7:128-134 |
| بيانات النشر: | Sumart Processing Society for Minerals, Environment and Energy, 2018. |
| سنة النشر: | 2018 |
| مصطلحات موضوعية: | Materials science, chemistry, visual_art, Interface (computing), visual_art.visual_art_medium, chemistry.chemical_element, Epoxy, Composite material, Copper, High humidity |
| تدمد: | 2187-1337 2186-702X |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::e195ddbd44c345e857d7fbe2ddcd0a45 https://doi.org/10.7791/jspmee.7.128 |
| حقوق: | OPEN |
| رقم الأكسشن: | edsair.doi...........e195ddbd44c345e857d7fbe2ddcd0a45 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 21871337 2186702X |
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