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Thermomechanical Analysis of Plastic Ball Grid Arrays With Vapor Pressure Effects

التفاصيل البيبلوغرافية
العنوان: Thermomechanical Analysis of Plastic Ball Grid Arrays With Vapor Pressure Effects
المؤلفون: Huck Beng Chew, Li Cheng, W.G. Cheong, Tianfu Guo
المصدر: IEEE Transactions on Components and Packaging Technologies. 32:12-19
بيانات النشر: Institute of Electrical and Electronics Engineers (IEEE), 2009.
سنة النشر: 2009
مصطلحات موضوعية: Cracking, Materials science, Vapor pressure, Ball grid array, Thermal, Constitutive equation, Electronic packaging, Thermomechanical analysis, Electrical and Electronic Engineering, Composite material, Finite element method, Electronic, Optical and Magnetic Materials
الوصف: This study adopts a mechanism-based computational approach to gain insights into the delamination and cracking of plastic ball grid array (PBGA) packages under moisture sensitivity test (MST) conditions. The possible crack paths in the molding compound are first examined by modeling the fully porous over-mold with void-containing cell elements. These computational cells are governed by a Gurson constitutive relation, extended to account for vapor pressure effects. We show that the corner of the die/die-attach interface presents a likely site for crack initiation under MST conditions. Failure along this interface of interest is then examined by deploying a single row of computational cells along the die/die-attach interface. Under combined thermal and vapor pressure loading, delamination concurrently occurs at both the die corner and the die center; these competing damage sites lead to the rapid and complete delamination of the die/die-attach interfaces.
تدمد: 1557-9972
1521-3331
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e20ca64b4a54b20f0a4b53c9e79798a3
https://doi.org/10.1109/tcapt.2008.2004602
حقوق: CLOSED
رقم الأكسشن: edsair.doi...........e20ca64b4a54b20f0a4b53c9e79798a3
قاعدة البيانات: OpenAIRE
الوصف
تدمد:15579972
15213331