التفاصيل البيبلوغرافية
| العنوان: |
Reliable and Low Forming Voltage RRAM Enabled by Contact Shrinking and Pre-Soldering Baking |
| المؤلفون: |
C.H. Wang, F.M. Lee, Y.Y. Lin, P.H. Tseng, K.C. Hsu, D.Y. Lee, M.H. Lee, H.L. Lung, K.Y. Hsieh, K.C. Wang, C.Y. Lu |
| المصدر: |
Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials. |
| بيانات النشر: |
The Japan Society of Applied Physics, 2018. |
| سنة النشر: |
2018 |
| مصطلحات موضوعية: |
Materials science, business.industry, Soldering, Optoelectronics, business, Resistive random-access memory, Voltage |
| URL الوصول: |
https://explore.openaire.eu/search/publication?articleId=doi_________::e32b193dcf623f8644e87d3660de6f5d
https://doi.org/10.7567/ssdm.2018.b-1-04 |
| رقم الأكسشن: |
edsair.doi...........e32b193dcf623f8644e87d3660de6f5d |
| قاعدة البيانات: |
OpenAIRE |
