The Step and Flash Imprint Lithography (S-FILTM) process is a step and repeat nano-imprint lithography (NIL) technique based on UV curable low viscosity liquids. Generally nano-imprint lithography (NIL) is a negative acting process which makes an exact replica of the imprint mold and is subsequently dry developed to reveal the underlying substrate material. The authors have demonstrated a novel imprint process, which reverses the tone of the imprint and enables dry develop on nonflat wafers with good critical dimension control and resist layer thickness. This positive acting NIL process termed SFIL/RTM (reverse tone S-FIL), enables nano-imprinting over intrinsic substrate topology of the type commonly found on single side polished substrates. This paper describes the SFIL/R process and the results of pattern transfer on single side polished silicon wafers.
