Fine-pitch <111>-oriented NT-Cu/SiO2 hybrid joints with high thermal fatigue resistance and low contact resistivity
| العنوان: | Fine-pitch <111>-oriented NT-Cu/SiO2 hybrid joints with high thermal fatigue resistance and low contact resistivity |
|---|---|
| المؤلفون: | Jia-Juen Ong, Wei-Lan Chiu, Hsiang-Hung Chang, Dinh-Phuc Tran, Chih Chen |
| المصدر: | 2023 International Conference on Electronics Packaging (ICEP). |
| بيانات النشر: | IEEE, 2023. |
| سنة النشر: | 2023 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::ec7994d2fe1fc1866f28a7b3850121cd https://doi.org/10.23919/icep58572.2023.10129702 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........ec7994d2fe1fc1866f28a7b3850121cd |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |