Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications

التفاصيل البيبلوغرافية
العنوان: Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications
المؤلفون: Chung-Shi Liu, En-Hsiang Yeh, Monsen Liu, Jeng-Shien Hsieh, Ching-Wen Hsiao, Chuei-Tang Wang, Chung-Hao Tsai, Doug C. H. Yu, Chen-Shien Chen, Hsu-Hsien Chen, Mirng-Ji Lii
المصدر: 2013 IEEE International Electron Devices Meeting.
بيانات النشر: IEEE, 2013.
سنة النشر: 2013
مصطلحات موضوعية: Engineering, Coaxial antenna, business.industry, Antenna measurement, Electrical engineering, Antenna factor, law.invention, Antenna array, Microstrip antenna, law, Dipole antenna, Antenna (radio), business, Monopole antenna
الوصف: Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluated first and proved to have 5 dBi of gain. Meanwhile, the interconnect from chip to antenna feeding line is demonstrated to only have 0.7 dB loss, which can save 19 % PA output power compared with that of flip-chip package. Finally, the system performance of 4 × 4 antenna array integrated with RF chip on the InFO structure shows 14.7 dBi of array gain in a small form factor of 10 × 10 × 0.5 mm3.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f24c7397624ab8f65cd58e6369ec3cc9
https://doi.org/10.1109/iedm.2013.6724687
رقم الأكسشن: edsair.doi...........f24c7397624ab8f65cd58e6369ec3cc9
قاعدة البيانات: OpenAIRE