Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

التفاصيل البيبلوغرافية
العنوان: Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys
المؤلفون: Sheng Chen, Xinbao Wang, Zhiqiu Guo, Changjun Wu, Yongxiong Liu, Ya Liu, Xuping Su
المصدر: Coatings
Volume 13
Issue 2
Pages: 285
بيانات النشر: Multidisciplinary Digital Publishing Institute, 2023.
سنة النشر: 2023
مصطلحات موضوعية: lead-free low-temperature solder, tensile strength, melting point, Materials Chemistry, wettability, Surfaces and Interfaces, Sn-Bi-Ag-Si, Surfaces, Coatings and Films
الوصف: In this study, we investigated the microstructure, mechanical properties, and thermal performance of Sn-xBi-1Ag (x = 35, 37, 45, and 47 wt.%) solders, with a particular focus on the effect of adding trace Si atoms. The impact of different Ag concentrations on the properties of Sn-xBi-Ag-0.5Si solders was also studied. The results indicated that as the amount of Bi added to Sn-xBi-1Ag solder alloys increased, the tensile strength, microhardness, melting temperature, and melting range decreased somewhat, but the wettability improved. The Cu6Sn5 layer between the soldering alloy and the Cu substrate became thinner upon increasing the Bi content. Adding microcrystalline Si atoms to the Sn-Bi-1Ag alloy improved the tensile strength and microhardness, but the melting point and melting range were not significantly changed. The wettability was optimized, and the diffusion layer formed with the Cu matrix was significantly thinner. By increasing the Ag content in the Sn-Bi-(1,3)Ag-0.5Si alloy, the tensile strength of the alloy was continuously strengthened, while the hardness decreased slightly and the melting point and melting range increased slightly. The wettability was greatly improved, and the Cu6Sn5 layer became thinner.
وصف الملف: application/pdf
اللغة: English
تدمد: 2079-6412
DOI: 10.3390/coatings13020285
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0627694c5383cb5438093581974531ae
حقوق: OPEN
رقم الأكسشن: edsair.doi.dedup.....0627694c5383cb5438093581974531ae
قاعدة البيانات: OpenAIRE
الوصف
تدمد:20796412
DOI:10.3390/coatings13020285