High-Throughput High-Resolution Digital Image Correlation Measurements by Multi-Beam SEM Imaging
| العنوان: | High-Throughput High-Resolution Digital Image Correlation Measurements by Multi-Beam SEM Imaging |
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| المؤلفون: | R. L. Black, T. Garbowski, C. Bean, A. L. Eberle, S. Nickell, D. Texier, V. Valle, J. C. Stinville |
| المساهمون: | University of Illinois at Urbana-Champaign [Urbana], University of Illinois System, Carl Zeiss MultiSEM GmbH, Institut Clément Ader (ICA), Institut Supérieur de l'Aéronautique et de l'Espace (ISAE-SUPAERO)-Institut National des Sciences Appliquées - Toulouse (INSA Toulouse), Institut National des Sciences Appliquées (INSA)-Université de Toulouse (UT)-Institut National des Sciences Appliquées (INSA)-Université de Toulouse (UT)-Université Toulouse III - Paul Sabatier (UT3), Université de Toulouse (UT)-Centre National de la Recherche Scientifique (CNRS)-IMT École nationale supérieure des Mines d'Albi-Carmaux (IMT Mines Albi), Institut Mines-Télécom [Paris] (IMT)-Institut Mines-Télécom [Paris] (IMT), Institut Pprime (PPRIME), Université de Poitiers-ENSMA-Centre National de la Recherche Scientifique (CNRS) |
| المصدر: | Experimental Mechanics Experimental Mechanics, In press, ⟨10.1007/s11340-023-00961-y⟩ |
| بيانات النشر: | Springer Science and Business Media LLC, 2023. |
| سنة النشر: | 2023 |
| مصطلحات موضوعية: | [SPI]Engineering Sciences [physics], High-Resolution Digital Image Correlation, Mechanics of Materials, Mechanical Engineering, Nickel-based Superalloy, Strain Localization, Slip Localization, MultiSEM, Aerospace Engineering, Scanning Electron Microscopy |
| الوصف: | International audience; Background Recent improvements in spatial resolution and measurement sensitivity for high-resolution digital image cor-relation (HR-DIC) now provide an avenue for the quantitative measurement of deformation events and capturing the physicalnature of deformation mechanisms. However, HR-DIC measurements require significant time due to scanning electron imageacquisition; such a limitation prevents the widespread use of HR-DIC for material characterization.Objective Apply a novel SEM acquisition technology to enhance HR-DIC measurements for high throughput applications.Methods Multi-beam SEM technology is employed to image an entire gauge length at once at high resolution and at nearly ahundredfold acceleration of typical HR-DIC image acquisition, even when automated stage movement and image acquisitionare employed. These images were fed into a discontinuity-tolerant HR-DIC software to determine slip localization inducedby non-metallic inclusions and grain structure.Results Slip localization was able to be analyzed to an unprecedented level, with over 210,000 slip bands able to be investi-gated, with the most intense slip localizing near and parallel to twin boundaries and in the vicinity of non-metallic inclusionclusters. Additionally, secondary slip activation and grain boundary shearing by intense dislocation pileups are observed toreduce slip amplitude near and parallel to twin boundaries.Conclusions By performing HR-DIC in conjunction with a multi-beam SEM, high-throughput measurements of large field-of-view, high-resolution images were able to be performed in a timely manner. These measurements provided an immensenumber of slip events for statistical analysis to be performed on to relate to microstructural features. |
| تدمد: | 1741-2765 0014-4851 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9e83aa8c00b5e4a57b3eb99380d48aa9 https://doi.org/10.1007/s11340-023-00961-y |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi.dedup.....9e83aa8c00b5e4a57b3eb99380d48aa9 |
| قاعدة البيانات: | OpenAIRE |
Find this article in full text from Springer Verlag. | تدمد: | 17412765 00144851 |
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