Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels
| العنوان: | Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels |
|---|---|
| المؤلفون: | Arnaud Peizerat, Perrine Batude, Christoforos G. Theodorou, P. Sideris, Gilles Sicard |
| المساهمون: | Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC), Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA) |
| المصدر: | MOCAST 2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST) 2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST), Jul 2021, Thessaloniki, Greece. ⟨10.1109/MOCAST52088.2021.9493347⟩ |
| بيانات النشر: | IEEE, 2021. |
| سنة النشر: | 2021 |
| مصطلحات موضوعية: | Coupling, Physics, Pixel, business.industry, Transistor, [SPI.TRON]Engineering Sciences [physics]/Electronics, Photodiode, law.invention, Optics, law, Logic gate, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, Image sensor, business, ComputingMilieux_MISCELLANEOUS, Ground plane, Diode |
| الوصف: | This study investigates the inter-tier coupling, for a Back-Side Illuminated (BSI) 4-Transistor (4T) pixel with its diode and Transfer Gate on the bottom tier and the rest of its circuitry on the top tier of a 3D Sequential Integration (3DSI) process. Variations due to coupling are compared with variations due to temperature, showing that both effects may result in a readout error of the same order of magnitude for the top-tier readout circuit. Nevertheless, we demonstrate that in a typical rolling readout, the sequence of the pixel control signals makes the coupling effect nearly negligible. As a result, we suggest that the fabrication of an inter-tier ground plane for electrical isolation is not strictly necessary for Monolithic 3D pixels when the readout top tier is directly stacked on the photodiode bottom tier. |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a1711090bfe8e6b968fbb8bd6e972c74 https://doi.org/10.1109/mocast52088.2021.9493347 |
| حقوق: | OPEN |
| رقم الأكسشن: | edsair.doi.dedup.....a1711090bfe8e6b968fbb8bd6e972c74 |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |