A 256 energy bin spectrum X-ray photon-counting image sensor providing 8Mcounts/s/pixel and on-chip charge sharing, charge induction and pile-up corrections
| العنوان: | A 256 energy bin spectrum X-ray photon-counting image sensor providing 8Mcounts/s/pixel and on-chip charge sharing, charge induction and pile-up corrections |
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| المؤلفون: | S. Stanchina, E. Marche, Arnaud Peizerat, J-P. Rostaing, P. Radisson, P. Ouvrier-Buffet |
| المساهمون: | Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), MULTIX SA, C/O Thales Electron Devices SA |
| المصدر: | 2017 Symposium on VLSI Circuits (978-4-86348-606-5) 2017 Symposium on VLSI Circuits (978-4-86348-606-5), Jun 2017, Kyoto, Japan. pp.C246-C247, ⟨10.23919/VLSIC.2017.8008496⟩ |
| بيانات النشر: | HAL CCSD, 2017. |
| سنة النشر: | 2017 |
| مصطلحات موضوعية: | medicine.medical_specialty, ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION, 02 engineering and technology, 01 natural sciences, Bin, Charge sharing, spectrum, X-ray, [SPI]Engineering Sciences [physics], pixel, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, medicine, Image sensor, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, Physics, Pixel, 010308 nuclear & particles physics, business.industry, 020208 electrical & electronic engineering, CMOS, Photon counting, Spectral imaging, imager, Optoelectronics, Photonics, business, [SPI.SIGNAL]Engineering Sciences [physics]/Signal and Image processing, Energy (signal processing) |
| الوصف: | International audience; To achieve better and faster material discrimination in applications like security inspection, X-Ray image sensorsgiving a highly resolved energy spectrum per pixel are required. In this paper, a new pixel architecture for spectral imaging ispresented, exhibiting a 256 bin spectrum per pixel in a single image duration, up to two orders of magnitude higher thanprevious works. A prototype circuit, composed of 4x8 pixels of 756$\mu$mx800$\mu$m and hybridized to a CdTe crystal, wasfabricated in a 0.13$\mu$m process. Our pixel architecture has been measured at 8 Mcounts/s/pixel while embedding on-chipcharge sharing, charge induction and pile-up corrections |
| اللغة: | English |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f7776b72f0bcb43c0d7f998498f0af68 https://hal-cea.archives-ouvertes.fr/cea-02194515 |
| رقم الأكسشن: | edsair.doi.dedup.....f7776b72f0bcb43c0d7f998498f0af68 |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |