Fabrication of 3D Copper Oxide Structure by Holographic Lithography for Photoelectrochemical Electrodes
| العنوان: | Fabrication of 3D Copper Oxide Structure by Holographic Lithography for Photoelectrochemical Electrodes |
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| المؤلفون: | Woo-Min Jin, Ji-Hwan Kang, Jun Hyuk Moon |
| المصدر: | ACS Applied Materials & Interfaces. 2:2982-2986 |
| بيانات النشر: | American Chemical Society (ACS), 2010. |
| سنة النشر: | 2010 |
| مصطلحات موضوعية: | Photocurrent, Copper oxide, Fabrication, Materials science, chemistry.chemical_element, Nanotechnology, engineering.material, Copper, chemistry.chemical_compound, chemistry, Chemical engineering, Coating, Electrode, engineering, Surface modification, General Materials Science, Lithography |
| الوصف: | We fabricated three-dimensional copper oxide structure by holographic lithography and electroless deposition. A five-beam interference pattern defined a woodpile structure of SU-8. The surface modification of SU-8 structure was achieved by multilayer coating of polyelectrolyte, which is critical for activating the surface for the reduction of copper. Copper was deposited onto the surface of the structure by electroless deposition, and subsequent calcinations removed the SU-8 structure and simultaneously oxidized the copper into copper oxide. The porous copper oxide structure was used as a photoelectrochemical electrode. Because of the highly porous structure, our structure showed higher photocurrent efficiency. |
| تدمد: | 1944-8252 1944-8244 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f85647d73c6f0274e4674b81d8b9ec7e https://doi.org/10.1021/am100773h |
| رقم الأكسشن: | edsair.doi.dedup.....f85647d73c6f0274e4674b81d8b9ec7e |
| قاعدة البيانات: | OpenAIRE |
Find this issue from the American Chemical Society | تدمد: | 19448252 19448244 |
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