تقرير
An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters
| العنوان: | An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters |
|---|---|
| المؤلفون: | Bruschi, P., Nurra, V. |
| المصدر: | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007) |
| سنة النشر: | 2008 |
| المجموعة: | Computer Science |
| مصطلحات موضوعية: | Computer Science - Other Computer Science |
| الوصف: | An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described. Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing) |
| نوع الوثيقة: | Working Paper |
| URL الوصول: | http://arxiv.org/abs/0802.3062 |
| رقم الأكسشن: | edsarx.0802.3062 |
| قاعدة البيانات: | arXiv |
| الوصف غير متاح. |