تقرير
High coherence superconducting microwave cavities with indium bump bonding
| العنوان: | High coherence superconducting microwave cavities with indium bump bonding |
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| المؤلفون: | Lei, Chan U, Krayzman, Lev, Ganjam, Suhas, Frunzio, Luigi, Schoelkopf, Robert J. |
| المصدر: | Appl. Phys. Lett. 116, 154002 (2020) |
| سنة النشر: | 2020 |
| المجموعة: | Condensed Matter Physics (Other) |
| مصطلحات موضوعية: | Physics - Applied Physics, Condensed Matter - Mesoscale and Nanoscale Physics |
| الوصف: | Low-loss cavities are important in building high-coherence superconducting quantum computers. Generating high quality joints between parts is crucial to the realization of a scalable quantum computer using the circuit quantum electrodynamics (cQED) framework. In this paper, we adapt the technique of indium bump bonding to the cQED architecture to realize high quality superconducting microwave joints between chips. We use this technique to fabricate compact superconducting cavities in the multilayer microwave integrated quantum circuits (MMIQC) architecture and achieve single photon quality factor over 300 million or single-photon lifetimes approaching 5 ms. To quantify the performance of the resulting seam, we fabricate microwave stripline resonators in multiple sections connected by different numbers of bonds, resulting in a wide range of seam admittances. The measured quality factors combined with the designed seam admittances allow us to bound the conductance of the seam at $g_\text{seam} \ge 2\times 10^{10} /(\Omega \text{m})$. Such a conductance should enable construction of micromachined superconducting cavities with quality factor of at least a billion. These results demonstrate the capability to construct very high quality microwave structures within the MMIQC architecture. |
| نوع الوثيقة: | Working Paper |
| DOI: | 10.1063/5.0003907 |
| URL الوصول: | http://arxiv.org/abs/2001.09216 |
| رقم الأكسشن: | edsarx.2001.09216 |
| قاعدة البيانات: | arXiv |
| DOI: | 10.1063/5.0003907 |
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