تقرير
Performance Analysis of DNA Crossbar Arrays for High-Density Memory Storage Applications
| العنوان: | Performance Analysis of DNA Crossbar Arrays for High-Density Memory Storage Applications |
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| المؤلفون: | De, Arpan, Mohammad, Hashem, Wang, Yiren, Kubendran, Rajkumar, Das, Arindam K., Anantram, M. P. |
| سنة النشر: | 2023 |
| المجموعة: | Computer Science Physics (Other) |
| مصطلحات موضوعية: | Computer Science - Emerging Technologies, Physics - Applied Physics, Physics - Biological Physics, Physics - Chemical Physics |
| الوصف: | Deoxyribonucleic acid (DNA) has emerged as a promising building block for next-generation ultra-high density storage devices. Although DNA has high durability and extremely high density in nature, its potential as the basis of storage devices is currently hindered by limitations such as expensive and complex fabrication processes and time-consuming read-write operations. In this article, we propose the use of a DNA crossbar array architecture for an electrically readable Read-Only Memory (DNA-ROM). While information can be written error-free to a DNA-ROM array using appropriate sequence encoding, its read accuracy can be affected by several factors such as array size, interconnect resistance, and Fermi energy deviations from HOMO levels of DNA strands employed in the crossbar. We study the impact of array size and interconnect resistance on the bit error rate of a DNA-ROM array through extensive Monte Carlo simulations. We have also analyzed the performance of our proposed DNA crossbar array for an image storage application, as a function of array size and interconnect resistance. While we expect that future advances in bioengineering and materials science will address some of the fabrication challenges associated with DNA crossbar arrays, we believe that the comprehensive body of results we present in this paper establishes the technical viability of DNA crossbar arrays as low-power, high-density storage devices. Finally, our analysis of array performance vis-a-vis interconnect resistance should provide valuable insights into aspects of the fabrication process such as the proper choice of interconnects necessary for ensuring high read accuracies. |
| نوع الوثيقة: | Working Paper |
| URL الوصول: | http://arxiv.org/abs/2304.14269 |
| رقم الأكسشن: | edsarx.2304.14269 |
| قاعدة البيانات: | arXiv |
| الوصف غير متاح. |