كتاب
Electronic failure analysis handbook: techniques and applications for electronic and electrical packages, components, and assemblies
| العنوان: | Electronic failure analysis handbook: techniques and applications for electronic and electrical packages, components, and assemblies |
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| المؤلفون: | Martin, Perry L. |
| المساهمون: | Dylls, D. David., Medora, Noshirwan K., Le May, Ian., Ludwig, Lawrence L., Kaplan, Herbert., Kessler, L. W., Semmens, J. E., Roche, David J., Erickson, J. J., Devaney, John R., Van Westerhuyzen, Dennis H., Vettraino, L. G., Blanchard, Richard A., Galler, Donald., Glover, Duncan., Kusko, Alexander., Loud, John D., Mimmack, Gregory J., Slenski, George., Denson, William., Muller, Gunter., Dunbar, William G. |
| وصف الملف: | text |
| Other Title: | Introduction to electronic failure analysis. Overview of electronic systems reliability. Product liability. Photography and optical microscopy. X-ray/radiographic component inspection. Infrared thermography. Acoustic micro imaging failure analysis of electronic devices. Metallography. Chemical characterization. Electronic and electrical characterization. Scanning electron microscopy and x-ray analysis. Miscellaneous techniques. Solder joints. Failure analysis of printed wiring assemblies. Wires and cables. Switches and relays. Connection technology. Semiconductors. Power and high-voltage considerations. |
| Relation: | Electronic reproduction. New York, N.Y. : McGraw Hill, 2000. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions. |
| الإتاحة: | https://www.accessengineeringlibrary.com/content/book/9780070410442 |
| قاعدة البيانات: | AccessScience |
Full Text Finder | ردمك: | 9780070410442 9780071449632 0070410445 0071449639 |
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