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Coupling Analysis on Microstructure and Residual Stress in Selective Laser Melting (SLM) with Varying Key Process Parameters

التفاصيل البيبلوغرافية
العنوان: Coupling Analysis on Microstructure and Residual Stress in Selective Laser Melting (SLM) with Varying Key Process Parameters
المؤلفون: Peiying Bian, Chunchang Wang, Kewei Xu, Fangxia Ye, Yongjian Zhang, Lei Li
المصدر: Materials, Vol 15, Iss 5, p 1658 (2022)
بيانات النشر: MDPI AG, 2022.
سنة النشر: 2022
المجموعة: LCC:Technology
LCC:Electrical engineering. Electronics. Nuclear engineering
LCC:Engineering (General). Civil engineering (General)
LCC:Microscopy
LCC:Descriptive and experimental mechanics
مصطلحات موضوعية: selective laser melting (SLM), process parameters, microstructure, residual stress, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
الوصف: With the application of Selective Laser Melting (SLM) technology becoming more and more widespread, it is important to note the process parameters that have a very important effect on the forming quality. Key process parameters such as laser power (P), scan speed (s), and scanning strategy (μ) were investigated by determining the correlation between the microstructure and residual stress in this paper. A total of 10 group 316L specimens were fabricated using SLM for comprehensive analysis. The results show that the key process parameters directly affect the morphology and size of the molten pool in the SLM deposition, and the big molten pool width has a direct effect on the larger grain size and crystal orientation distribution. In addition, the larger grain size and misorientation angle also affect the size of the residual stress. Therefore, better additive manufacturing grain crystallization can be obtained by reasonably adjusting the process parameter combinations. The transfer energy density can synthesize the influence of four key process parameters (P, v, the hatching distance (δ), and the layer thickness (h)). In this study, it is proposed that the accepted energy density will reflect the influence of five key process parameters, including the scanning trajectory (μ), which can reflect the comprehensive effect of process parameters more accurately.
نوع الوثيقة: article
وصف الملف: electronic resource
اللغة: English
تدمد: 1996-1944
Relation: https://www.mdpi.com/1996-1944/15/5/1658; https://doaj.org/toc/1996-1944
DOI: 10.3390/ma15051658
URL الوصول: https://doaj.org/article/03bc3009a14b4ee88bed2799f7ddd695
رقم الأكسشن: edsdoj.03bc3009a14b4ee88bed2799f7ddd695
قاعدة البيانات: Directory of Open Access Journals
الوصف
تدمد:19961944
DOI:10.3390/ma15051658