Vieta-Lucas Collocation Technique for Examination of the Flow of Casson Fluid over a Slippery Stretching Sheet Which Is Impacted by Thermal Slip, Ohmic Dissipation, and Variable Thermal Conductivity
التفاصيل البيبلوغرافية
العنوان:
Vieta-Lucas Collocation Technique for Examination of the Flow of Casson Fluid over a Slippery Stretching Sheet Which Is Impacted by Thermal Slip, Ohmic Dissipation, and Variable Thermal Conductivity
This work aimed to present the influence of the magnetic field and Ohmic dissipation on the non-Newtonian Casson fluid on a vertical stretched sheet to numerically solve the problem. Here, the variable thermal conductivity is taken as a linear function of temperature. Electric fields, thermal slip, and viscous dissipation effects are taken into consideration. A collection of physical conditions on the sheet’s enclosing wall and the momentum and heat transport processes are expressed as partial differential equations (PDEs). Some of the similarity transformations are used to convert the collection of PDE into a system of ordinary differential equations. This system is numerically treated by implementing the Vieta-Lucas spectral collocation method. Some observations are made for the investigation of method convergence. The effect of some different parameters on the velocity and temperature profiles is graphically represented. Additionally, this area of study has significant practical applications in a variety of industries, including paper production, thermal power generation, nuclear reactors, cooling of metallic sheets, glass fiber, and lubrication.
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