دورية أكاديمية
Effect of diamond particle size on thermophysical properties of diamond /Cu-B alloy composites
| العنوان: | Effect of diamond particle size on thermophysical properties of diamond /Cu-B alloy composites |
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| المؤلفون: | Xi WANG, Aolong KANG, Zengkai JIAO, Huiyuan KANG, Chengyuan WU, Kechao ZHOU, Li MA, Zejun DENG, Yijia WANG, Zhiming YU, Qiuping WEI |
| المصدر: | Jin'gangshi yu moliao moju gongcheng, Vol 44, Iss 2, Pp 169-178 (2024) |
| بيانات النشر: | Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd., 2024. |
| سنة النشر: | 2024 |
| المجموعة: | LCC:Materials of engineering and construction. Mechanics of materials LCC:Mechanical engineering and machinery |
| مصطلحات موضوعية: | thermal conductivity, diamond particle, gas pressure infiltration method, thermal expansion coefficient, diamond/copper-boron composite material, Materials of engineering and construction. Mechanics of materials, TA401-492, Mechanical engineering and machinery, TJ1-1570 |
| الوصف: | Using copper-boron alloy as the metal matrix and different-sized diamond particles through 110 μm, 230 μm to 550 μm as reinforcement, the diamond/copper-boron alloy composites were prepared via gas pressure infiltration technology under 1100 ℃ and 10 MPa gas pressure. The influences of the size of diamond particles on the configuration, interlayer phase distribution, and thermophysical properties of the composites were investigated. The results show that with the increase of particle size, there is a benefit of better interface bonding, and the thermal conductivity of the diamond/copper-boron composite is enhanced while the thermal expansion coefficient decreases. When the diamond particle size is 500 μm, the best performance of the composite is obtained. The thermal conductivity is 680.3 W/(m·K), and the thermal expansion coefficient increases from 4.095×10−6 K−1 to 7.139×10−6 K−1. |
| نوع الوثيقة: | article |
| وصف الملف: | electronic resource |
| اللغة: | Chinese |
| تدمد: | 1006-852X |
| Relation: | https://doaj.org/toc/1006-852X |
| DOI: | 10.13394/j.cnki.jgszz.2023.0062 |
| URL الوصول: | https://doaj.org/article/089dbf643a4f4f1dbac99ea65be0e19b |
| رقم الأكسشن: | edsdoj.089dbf643a4f4f1dbac99ea65be0e19b |
| قاعدة البيانات: | Directory of Open Access Journals |
Full Text Finder | تدمد: | 1006852X |
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| DOI: | 10.13394/j.cnki.jgszz.2023.0062 |